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R E V I S I O N E D E L L A D I S C U S S I O N E
irymotecydamysukyvowozigyqo
Inviata - 22/11/2021 : 15:08:35 Parameter
Layers: 10L
Material: RO4003C + IT180A
Board Thicknes: 2.3 mm
Copper Thicknes: 35/18/18/35 um
Line/Space: 3.5/4 mil (inner layer)
Smallest Hole Diameter: 0.15mm
Surface Treatment: ENIG(2U'')
Technical Feature:
Blind/Buride Via Holes; VIPPO; 10% Impedance control
Applications
Communication base station
Special Note:
More Technologies Limited has strong manufacturing capabilities and high-quality products and services. This is a 10-layer high-frequency mixed-pressing board with Blind/Buride Via Holes, Impedance control. The regular delivery time is 13 days, and the fastest delivery can be achieved in 8 days.
Exquisite craftsmanship to meet the needs of printed circuit boards for communication: (1) Mature mixing technology: FR4+PTFE, FR4+408HR, FR4+ROGERS, ceramic+FR4; (2) 3mil/3mil line width line spacing, impedance tolerance can be controlled at ±7%.
Eight applications of High Frequency PCB:
1. Digital Audio Broadcasting(DAB, Filters, Combiners)
2. Broadband RF Antennas (Satellite Radio, Power Amplifiers, WIFI/WiMax, RFID)
3. Military Electronics (Radars Manifolds and Feed Networks, ESM, Guidance)